Laser saw compatible with various processes which achieves high-speed, high-quality processing of ultra-thin Si
• Φ300 mm • Stealth Dicing™ • SDBG • SDTT
A space-saving solution for Φ300 mm dicing
Φ300 mm
Facing dual spindle
Space-saving layout
DFD6561 is equipped with uniquely developed short spindles and an optimized bridge-type ...
Advanced resistivity control technology eliminates electrostatic charge in high-purity water.
Rinse water resistivity can be controlled in the best condition at the dicing process of semiconductor industries or high ...
Realizes optimum wheel life by employing a new bas
Applications: Silicon wafer, Compound semiconductor wafers, Electronics components, etc
The newly developed GF01 Series in-feed grinding wheels ...
Flagship model for Φ300 mm wafers with high process extensibility
Φ300 mm
Facing dual spindle
DBG
Compatible with both frame and two-way*(frame/wafer) transferring
Various ...
“ICROS™ Tape has been the world's top protective tape used in semiconductor wafer backgrinding (BG) for many decades. In order to meet the strict requirements of the semiconductor market, we optimize the whole ...
Model: UVC-300A for up to 12”
UV-LED models which have a long life and low running cost are
cassette to cassette fully automatic system and 200mm (8”) manual
and 300mm (12”)
EX Series
Model:
EX-300 for Gr-12
The EX series is an adopted motor drive for expansion stage operation.
Expansion stroke and expansion speed can be controlled numerically.
And film auto-cut function is equipped ...
TEX-218G for up to GR-8
The TEX series is adopted air cylinder for expansion stage operation. It makes
equipment component become simple and realized easy maintenance.
FM-903 is normal type semi-automatic wafer mounter up to 8 inch(200mm) size of work.
Automatic operation means the operator is required only for loading and unloading workpieces. This contributes to stable tape and ...
This wafer mounter is ideal for diversified tape application and lamination conditions.
This model meets user requirements for manual equipment that is automated for only critical application work and that allows for ...
This model was developed for both pre-cut and normal tape.
The industry's first universal wafer mounter, it not only serves as a dedicated wafer mounter for pre-cut or normal tape, but can also be adapted to the ...
You can select a manual wafer mounter from a wide range of models to meet a variety of needs, from research and development to semi-custom production.
This manual wafer mounter series supports three different sizes of ...
Dry polishing wheels that achieve high die strength while maintaining gettering performance
Applications: Silicon wafer, etc
Due to the ultra-thinning of wafers, loss of gettering performance ...