fbpx
Image
Показано 41 - 60 из 125
dfl_7362
Product Classification

Disco-DFL7362

Laser saw compatible with various processes which achieves high-speed, high-quality processing of ultra-thin Si • Φ300 mm • Stealth Dicing™ • SDBG • SDTT
  • DFL7362 is a ...
DFD64501
Product Classification

Disco-DFD6561

A space-saving solution for Φ300 mm dicing Φ300 mm Facing dual spindle Space-saving layout DFD6561 is equipped with uniquely developed short spindles and an optimized bridge-type ...
super
bubbler
Product Classification

Super Bubbler Wac

Advanced resistivity control technology eliminates electrostatic charge in high-purity water. Rinse water resistivity can be controlled in the best condition at the dicing process of semiconductor industries or high ...
gf01_series
Product Classification

GF01 SERIES

Realizes optimum wheel life by employing a new bas
Applications: Silicon wafer, Compound semiconductor wafers, Electronics components, etc The newly developed GF01 Series in-feed grinding wheels ...
DFD6362
Product Classification

Disco-DFD6363

Flagship model for Φ300 mm wafers with high process extensibility Φ300 mm Facing dual spindle DBG Compatible with both frame and two-way*(frame/wafer) transferring Various ...
mitsui 1
mitsue
Product Classification

ICROS™ Tape

“ICROS™ Tape has been the world's top protective tape used in semiconductor wafer backgrinding (BG) for many decades. In order to meet the strict requirements of the semiconductor market, we optimize the whole ...
UVB-608i
Product Classification

UVB-608i for up to 8"

Black-light type UVB-608i UVB-608i is adopted black-light fluorescent lamp and designed minimal specification for exceptional cost-performance value.
UVC-4088
Product Classification

UVC-408 for 8”

High- pressure Mercury lamp models which have perfect UV curing performances is 200mm (8”) manual and 300mm (12”) manual system.
uvc300
Product Classification

UVC-300

Model: UVC-300A for up to 12” UV-LED models which have a long life and low running cost are cassette to cassette fully automatic system and 200mm (8”) manual and 300mm (12”)
grip ring3
Product Classification

Grip Ring

A reinforced plastic double grip rings are consist of inner and outer rings.
EX-300
Product Classification

EX-300

EX Series Model: EX-300 for Gr-12 The EX series is an adopted motor drive for expansion stage operation. Expansion stroke and expansion speed can be controlled numerically. And film auto-cut function is equipped ...
TEX-218G
Product Classification

TEX-218G

TEX-218G for up to GR-8 The TEX series is adopted air cylinder for expansion stage operation. It makes equipment component become simple and realized easy maintenance.

Product Classification

FM-903S

FM-903 is normal type semi-automatic wafer mounter up to 8 inch(200mm) size of work. Automatic operation means the operator is required only for loading and unloading workpieces. This contributes to stable tape and ...
3343
Product Classification

FM-3343

This wafer mounter is ideal for diversified tape application and lamination conditions. This model meets user requirements for manual equipment that is automated for only critical application work and that allows for ...
6648
Product Classification

FM-6648 / 6643

This model was developed for both pre-cut and normal tape. The industry's first universal wafer mounter, it not only serves as a dedicated wafer mounter for pre-cut or normal tape, but can also be adapted to the ...
FM-22464
Product Classification

FM-2246 / 2248 /2243

You can select a manual wafer mounter from a wide range of models to meet a variety of needs, from research and development to semi-custom production. This manual wafer mounter series supports three different sizes of ...
Dwr1720
Product Classification

DWR1720

Deionized Water Recycling Unit A super-compact deionized water recycling unit for advanced environmental performance • Integrates deionized water ...
Gettering DP
Gettering DP1
Product Classification

Gettering DP

Dry polishing wheels that achieve high die strength while maintaining gettering performance
Applications: Silicon wafer, etc Due to the ultra-thinning of wafers, loss of gettering performance ...
DP08
Product Classification

DP08 Series

Chemical-free stress relief dry polishing wheel| In addition to wafer polishing in the conventional grinding process, the DP08 realizes ...
GF136
Product Classification

GF13 Series

GRINDING WHEELS Improved productivity and grinding quality Grinding wheel for semiconductor wafer
•Supports SDBG ...

Head Office

Clark Office

Baguio Office

Cebu Office